星期一, 12 10 月, 2026
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Platform

Qualcomm (387)NXP (383)Intel (379)NVidia (253)HorizonRobotics (119)

UCIe-3D：採用先進 3D 封裝並縮小凸點間距的 SiP 架構（英特爾）

Platform
UCIe-3D: SiP Architectures With Advanced 3D Packaging With Shrinking Bump Pitches (Intel) , Source Link
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Intel Gaudi 2 加速器穩定擴散速度比 NVIDIA H100 快 55%，AI 基準對決比 A100 快 3 倍

Platform
Intel Gaudi 2 Accelerator Up To 55% Faster Than NVIDIA H100 In Stable Diffusion, 3x Faster Than A100 In AI Benchmark Showdown , Source Link
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比最強者還強？高通 Snapdragon 8S Gen 3 SoC 於月中發布

Platform
Stronger than the strongest? Qualcomm Snapdragon 8S Gen 3 SoC announced mid-month , Source Link
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LGES與高通結盟開發先進電池管理系統

Platform
LGES, Qualcomm Forge Alliance to Develop Advanced Battery Management System , Source Link
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LG Energy Solution 與高通合作開發電池管理系統 – Teslarati

Platform
LG Energy Solution & Qualcomm to develop battery management systems - Teslarati , Source Link
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關於 Nvidia 的另一件事

Platform
And One More Thing About Nvidia , Source Link
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分立裝置市場成長因素|仙童半導體、恩智浦、安森美半導體

Platform
Discrete Devices Market Growth Factors | Fairchild Semiconductor, NXP, ON Semiconductor , Source Link
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嵌入式安全系統市場規模（營收）|英飛凌、意法半導體、恩智浦半導體

Platform
Embedded Security System Market Size (Revenue) | Infineon, STMicroelectronics, NXP Semiconductors , Source Link
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高通將於 2024 年 3 月推出新旗艦晶片組 – Pokde.Net

Platform
Qualcomm To Unveil New Flagship Chipset This March 2024 – Pokde.Net , Source Link
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高通預告另一款旗艦晶片組將於三月推出

Platform
Qualcomm teases another flagship chipset coming out in March , Source Link
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