星期四, 25 6 月, 2026
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Qualcomm (377)NXP (374)Intel (372)NVidia (245)HorizonRobotics (118)

Galaxy S24 完成了三星 AI 拼圖的最後一塊

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Galaxy S24 completes the final piece of Samsung's AI puzzleSource Link
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三星自研AP Exynos 2400復活，得益於AI

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Samsung's self-developed AP Exynos 2400 revives, thanks to AISource Link
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台積電與三星加速UCIe商業化，1H24進入chiplet量產競賽

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TSMC and Samsung accelerate UCIe commercialization, entering chiplet mass production race in 1H24Source Link
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是什麼導致三星不願意在 Galaxy S24 上添加衛星通訊功能？

Platform
What's causing Samsung to balk at adding satellite communication to Galaxy S24?Source Link
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新加坡取消對台積電在新加坡生產先進晶片的獎勵措施

Platform
Singapore repitch incentives for TSMC to produce advanced chips thereSource Link
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Cincoze 超薄嵌入式電腦 – 展示一台電腦的強大功能，兩種用途

Platform
Cincoze slim embedded computers - demonstrating power of one computer, two purposesSource Link
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高通發起第六屆台灣創新挑戰賽，聚焦人工智慧電腦與邊緣人工智慧

Platform
Qualcomm ignites the 6th edition of the Taiwan Innovation Challenge focused on AI PCs and Edge AISource Link
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Sundram Fasteners 與泰米爾納德邦政府簽署價值 141.1 億盧比的諒解備忘錄

Platform
Sundram Fasteners signs Rs 1,411 crore MoU with Government of Tamil NaduSource Link
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專訪地平線創辦人兼CEO於凱博士

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Interview with Dr. Yu Kai, Founder and CEO of Horizon RoboticsSource Link
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CES2024 回顧：我們學到了什麼 | IBC-IBC365

Platform
CES2024 Review: What We Learned | IBC - IBC365Source Link
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