星期日, 2 11 月, 2025
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Qualcomm

英偉達、高通與賓士、寶馬在科技領域取得重大勝利

Europe
Nvidia, Qualcomm score big tech wins with Mercedes, BMWSource Link
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CoolSo Technology、清華大學是 EE 挑戰賽的獲獎者

Platform
CoolSo Technology, Tsinghua U Among EE Challenge WinnersSource Link
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每週新聞綜述：美國國會因擔心中國晶片主導地位而敦促徵收關稅

Platform
Weekly news roundup: US congress urges tariffs amid concerns over China's chip dominanceSource Link
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Galaxy S24 完成了三星 AI 拼圖的最後一塊

Platform
Galaxy S24 completes the final piece of Samsung's AI puzzleSource Link
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三星自研AP Exynos 2400復活，得益於AI

Platform
Samsung's self-developed AP Exynos 2400 revives, thanks to AISource Link
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台積電與三星加速UCIe商業化，1H24進入chiplet量產競賽

Platform
TSMC and Samsung accelerate UCIe commercialization, entering chiplet mass production race in 1H24Source Link
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是什麼導致三星不願意在 Galaxy S24 上添加衛星通訊功能？

Platform
What's causing Samsung to balk at adding satellite communication to Galaxy S24?Source Link
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高通發起第六屆台灣創新挑戰賽，聚焦人工智慧電腦與邊緣人工智慧

Platform
Qualcomm ignites the 6th edition of the Taiwan Innovation Challenge focused on AI PCs and Edge AISource Link
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CES2024 回顧：我們學到了什麼 | IBC-IBC365

Platform
CES2024 Review: What We Learned | IBC - IBC365Source Link
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無線汽車充電市場飆升至 115.274 億美元

Platform
Wireless Car Charging Market Surging to US$11,527.4 MillionSource Link
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